Process Capability

Inari Process Capability

Category Description Unit Inari
Wafer Sort Wafer backlap - Si wafer Yes
- Max wafer size in 8
- Min thickness um 125
- Thickness accuracy um 12.5
Wafer DC probe um Yes
Wafer RF probe um Yes
Auto wafer visual and reject capture into wafer map (inkless wafer map) Yes
Manual wafer visual and inking   Yes
Wafer saw - Si wafer   Yes
Wafer saw - GaAs wafer   No
Wafer scribe and break   Yes
Wafer laser cut   No
Die level tape and reel (for die sell) Yes
SMT Smallest SMT component 01005
Die level tape and reel (for die sell) Yes
Smallest 01005 pad um 175x225
DA Thinnest die (Si and GaAs) mil 4
Smallest die size mil 7.3x7.3
Medium thermal epoxy (3-10W/mK) 1295SA
Low thermal epoxy (<3W/mK) 84-1LMIS
Eutectic DA capability No
Biggest die aspect ratio for GaAs die with 4- 5mil thickness mil 2:1
Post DA, auto chip coating No
Stack die capability Yes
Flip chip capability Yes
WB Gold wire size mil 1.0
Al pad bonding capability Yes
Die to die bonding capability Yes
Gold ball bond, min bond pad opening for 1mil wire um 60 x 60
Gold ball bond, min wire loop for 1.0mil wire um 100(Std. Bond) 60(RSSB)
Minimum bond pad pitch for 1.0mil wire um 75(Bond pad on die)
75(Bond pad on PCB)
Gold ball bond, min bond pad opening for 0.8mil wire um NA
Gold ball bond, min wire loop for 0.8mil wire um NA
Minimum bond pad pitch for 0.8mil wire mm NA
Mold Available mold cap height mm 0.5 and 0.6
Ultra low stress compound - for product with high internal stress Yes
Mold mc with void vacuum (qty) / total mold mc qty Yes
Mold mc with panel vacuum(qty) / total mold mc qty Yes
Saw Package saw accuracy um 50
Smallest package mm 1.6 x 2.0
Test RF Test capability Yes
Reliability IR Yes
UBPP Yes
FA X-Section / Backlap Yes
X-Ray Yes
T/C - Scan Yes

 

Amertron Process Capability

Category Description Unit Amertron
DA Thinnest die (Si and GaAs) mil 4
Smallest die size mil 8*8
WB Gold wire size mil 0.8~1.2
Al pad bonding capability Yes
Die to die bonding capability Yes
Gold ball bond, min bond pad opening for 0.8mil wire um 55 x 55
Gold ball bond, min wire loop for 0.8mil wire um 85
Minimum bond pad pitch for 0.8mil wire um 60
Aluminium wire size um 1.2
Mold Available mold cap height mm 0.6~1.2 per customization
Ultra low stress compound - for product with high internal stress Yes
Mold mc with void vacuum (qty) / total mold mc qty Yes
Mold mc with panel vacuum(qty) / total mold mc qty Yes
Cap Welding Welding size TO18,46,39,5
Casting Jetting capability Yes
Dispensing capability Yes
Saw Package saw accuracy um 50
Smallest package mm 2.3*1.95
Trim/Form Leads Trim/Form capability Yes
Final Test Electrical test capability Yes
Optical test capability Yes
Reliability Reflow Oven Yes
Thermal Cycling Yes
FA X-Section Yes
X-Ray Yes